203
Days04
Hours46
Minutes
General technologies, materials, and equipment related to semiconductor post-processing (packaging materials, assembly equipment, wafer-level packaging, fan-out packaging (FO-WLP, FO-PLP), 3D/2.5D packaging, PLP, test systems, handling equipment, package design tools, simulators, etc.)
Held with concurrent exhibitions.
Taipei Nangang Exhibition Center, Hall 2
1) We will send you emails with the latest information on exhibitions around the world. Sign up for our email newsletter here.
2) Are you considering exhibiting? Please use our exhibitor support. Japan Exhibition Support (Other areas are in preparation)
3) Turn your trade show demos into winning videos and promote to prospects globally: "Exhibition video marketing"
