Exhibition Description
Assembly Equipment, Packaging Materials/Components, Analysis/Simulation Software for IC Packaging, Semiconductor Device Inspection Equipment, SATS/Contract Design Services, Plating/Etching Materials/Equipment, MEMS Device Manufacturing Equipment
Asia's leading exhibition for IC final manufacturing gathering advanced equipment, materials and services. All kinds of packaging technologies such as semiconductor assembly equipment, inspection equipment, packaging materials, plating and etching, etc. will be exhibited, making it an ideal show to expand sales channels to manufacturers of semiconductors, sensors, electronic components, electronic devices, automobiles, etc.
Held with concurrent exhibitions.
